Chinese company LeEco is working hard on developing its new flagship, although no official specifics have been provided yet. However, information on the upcoming handset has leaked online, even though the device has yet to receive a name and currently goes by the code number LEX720.
An image of the LeEco flagship has surfaced online, showing the rear shell of the smartphone and revealing that it will come with dual cameras, according to. The picture also suggests that the shell features the LeEco logo on the back, thus confirming that this is a phone developed by the former Letv company. At the same time, the image hints that the back case could actually be made out of metal.
The design of the back case and the dual camera setup is quite interesting, if not funny. The image shows that the dual camera setup resembles a human face, with a rather surprised expression.
The fingerprint sensor is placed on the back of the phone
Still, the opening just below the camera seems to be for the fingerprint sensor, which is actually placed on the back of multiple LeEco phones, so this is quite in line with the company’s design philosophy.
The leaked image also reveals that the new device will come with antenna lines at the top and the bottom of the case. There’s not much information on the specs for the upcoming phone, but it is said to pack a Snapdragon 821, 8GB of RAM, and dual cameras. It could also come with 32GB of internal storage and possibly the option to add more using a micro-SD card.
It’s worth mentioning that the dual cameras could be produced by, considering that a recent report has revealed that the South Korean company will allegedly provide such phone components to Xiaomi, Oppo, and LeEco.
Word is that LeEco will be unveiling its latest flagship tomorrow, during an event organized in Shanghai, China.